06/02/2010, Irvine, California
New Solder Paste Formulation Technology Resolves Graping Problems
No Need for Sour Grapes
The electronics industry's never-ending miniaturization quest has constantly challenged conventional processes, forcing solutions to problems that are a direct result of the move to such tight geometries. At board level, it's safe to say that a large majority of these issues have to do with the deposit volumes required to achieve high-integrity solder joints for such small components. So, the soldering process - from print through reflow - is front and center.