The forming of a resin/fiber material into a solid mass of prescribed shape and size
Electronic Molding Compounds
Protect active and passive components, such as ceramic and tantalum capacitors and resistors. Designed for both automolds and conventional molds.
A broad category of molding products.
Low Pressure Molding
Low pressure molding is a polymide hot melt adhesive designed as a viable solution to encapsulate printed crcuit boards (PCB). Applications include small circuit boards for consumer electronics.
Opto Molding Compounds
Mold compounds designed with high optical properties. Typical applications would include (LED's) light emitting diodes used in many lighting applications including brake lights, flash lights, and standard electronic equipment like DVD's as indicator lights.
Semiconductor Molding Compounds
Molding materials are used to encapsulate semiconductor packaging. Integrated Circuits (IC) are bonded down to packaging with die attach materials and encapsulated with mold compounds to protect the circuit. Applications include TSOP's QFP's, QFN's, SOIC's, CSP's, BGA's along with several other standard SMT devices.