Potting & Encapsulating

Aerospace - Potting

To fill honeycomb core with a thermoset resin to increase fastener retention.

Automotive Component - Potting

To surround or envelop an automotive component in a liquid resin to protect it from environmental conditions.

Dam & Fill Encapsulants

Dam and Fill encapsulants are used to encapsulate wire bonded chips. First a dam is applied with the high viscous dam material, then the formed basin is filled with the low viscous fill material.

Deep-Section Cure

Thermoset potting materials that have low exothermatic conditions allowing for large mass or deep sections.

General Industrial

A broad range of materials used to surround, coat or envelop a part or component in a liquid resin to protect it from environmental conditions.

Epoxy
A thermosetting resin used mainly in strong adhesives, coatings and laminates .

Flowable
Low viscosity resins that flow into voids.

High Strength

Hot Melt
A thermoplastic material that is melted and applied in a molten state.

Silicones
One-component adhesive / sealant that cures to a tough rubbery solid upon exposure to moisture in the air. The 2-component version cures after mixing the components.

Urethanes
One or two-part adhesives that provide high strength bonds on a wide variety of substrates.

Glob Tops

Encapsulants used without dams to encapsulate wire bonded chips.

Lid Attach

Having the quality or power of conducting heat.

Opto Encapsulants

Opto encapsulants are high performance encapsulants designed with specific optical performance requirements. Typical applications include (LED's) Light Emitting diodes. Other types of opto encapsulants may be used in brake lights, flashlights and fiber optics.

Potting / Encapsulating - Electronics

Potting
To surround, coat or envelop an electronic component in a liquid resin to protect it from environmental conditions.

Encapsulating
To surround, coat or envelop an electronic component in a liquid resin to protect it from environmental conditions.

Dam & Fill Encapsulants

Dam and Fill encapsulants are used to encapsulate wire bonded chips. First a dam is applied with the high viscous dam material, then the formed basin is filled with the low viscous fill material.

Glob Tops

Encapsulants used without dams to encapsulate wire bonded chips.

Opto Encapsulants

Opto encapsulants are high performance encapsulants designed with specific optical performance requirements. Typical applications include (LED's) Light Emitting diodes. Other types of opto encapsulants may be used in brake lights, flashlights and fiber optics.

Lid Attach

Having the quality or power of conducting heat.