Two different application technologies are employed for the protective encapsulation of wire bonded die: Glob top technology and Dam and fill technology. While glob top technology requires an encapsulant with a fine-tuned rheology, dam and fill technology uses the dam to limit the flow of the low viscosity fill material. Henkel's Hysol® and Eccobond™ encapsulants are available as either thermal or ultraviolet cure materials and are designed for the highest reliability in that they offer low coefficient of thermal expansion, high glass transition temperature, and low ionic content.