These are highly flowable, high purity, one-component encapsulants. Flip Chip applications require assistance with redistributing stress away from the solder joints to extend thermal aging and cycle life. A CSP or BGA application requires an underfill to improve the mechanical integrity of the assembly during a bend, vibration or drop test. Henkel's Flip Chip underfills are formulated with a high loading of specialty fillers to achieve low CTEs yet maintain the ability to flow fast in small gaps, possessing high glass transition temperatures and high modulus. Our CSP underfills are designed with little to no filler loading, a choice of glass transition temperatures, and modulus to match the intended application.