Die Attach Paste Adhesives

Die Attach Paste Adhesives

Ablestik Die Attach Paste Adhesives have been formulated to address multiple process conditions and application-specific requirements.

From our traditional Ablestik Die Attach Pastes to Self-Filleting materials and controlled flow technique, as well as award-winning Wafer-Backside Coating (WBC) technologies and Multicore Die Attach Solder Paste for semiconductor power devices, Henkel's Die Attach Paste solutions are unmatched.


Laminate Packages BGA, CSP, DRAM, Smart Card Leaded Packages SOIC, SOP, QFN, QFP, Discretes Die Attach Solder Paste
Laminate Packages BGA, CSP, DRAM, Smart Card Leaded Packages SOIC, SOP, QFN, QFP, Discretes Die Attach Solder Paste

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