Discrete Components
Despite the expansion of any number of integrated circuits, there is always a need for supporting discrete packages. As with almost all semiconductor devices, environmental protection is mostly afforded by epoxy-based mold compounds. Depending on the component, internal die placement is generally with a solder or silver die attach material, with non-conductive pastes also being used in selected areas.
| Die Attach Adhesives | Encapsulants | Molding Compounds |
|---|---|---|
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