Discrete Components

Despite the expansion of any number of integrated circuits, there is always a need for supporting discrete packages. As with almost all semiconductor devices, environmental protection is mostly afforded by epoxy-based mold compounds. Depending on the component, internal die placement is generally with a solder or silver die attach material, with non-conductive pastes also being used in selected areas.


Discrete components form the largest number of components in any electrical or electronic application.

Die Attach Adhesives Encapsulants Molding Compounds