Electronics Literature

(2.85 MB)

Catalog covers Henkel's broad range of PCB Assembly solutions.

(LT-5012 - 01/2012)

(.51 MB)
Henkel is the world’s leading and most progressive provider of qualified materials for printed circuit board (PCB) assembly and advanced soldering solutions.
LT-6644 - (01/13)

(3.7 MB)

Defense & Aerospace electronics solutions guide.

(LT-5294 - 04/2010)

Boards (FPCB) Solutions
(0.928 MB)
These material solutions along with Henkel's full suite of FPCB technologies, are delivering the adaptability and performance required for modern flex circuit manufacturing.
(APH-AE-210 - 07/2012)

(3.33MB)
Henkel’s preform LOCTITE ABLESTIK brand adhesive films address the requirements of today’s demanding applications. Preform film parts from the Global leader in adhesives.
(LT-6587 - 09/12)

(.613 MB)

Henkel’s solder alloy, 90iSC, is the solution to various market segments that require high reliability with RoHS compliance.

(LT6649 - 02/2013)

(1.2 MB)

Advanced conformal coating materials protect PCBs from thermal shock, moisture, corrosive materials, and a variety of other adverse conditions.

(LT-4990 - 03/2008)

Low viscosity single component, VOC free conformal coating.

(0.28 MB)


Toluene-Free Acrylic Conformal Coating

(LT-5105 - 06/2008)

(1.3 MB)

Unique hybrid system of epoxy and acrylate to achieve low vicosity, high reliability and good reworkability use of handheld devices.

(LT-5555 - 03/2013)

(.367 MB)
Unique epoxy hybrid system to achieve low viscosity, high reliability and complete reworkability for use on PoP, WLCSP, and CSP devices.
(LT-4988 - 05/2012)

(3.21 MB)

Industrial applications require materials solutions that can meet the everchanging demands for high reliability and improved performance.

(AE-D01 - 10/2010)

(3.98MB)

Our extended product line covers LED encapsulant, die attach, PCB protection and thermal management materials. High performance inks are also available for applications that dictate a printable solution.

(LT-5427 - 06/2011)

(1.4 MB)

Ultra fast curing, non-corrosive RTV silicone designed for potting, wire tacking, selective sealing, vibration dampening and repair / rework applications on PCBs.

(LT-4993 - 03/2013)

(0.285MB)
ICP 4000, ICP 4001, ICP 4298
Electrically Conductive Silicones for High Operating Temperatures
(AE13005 - 03/2013)    

(.469 MB)

Formulated for miniaturized assemblies that define today’s consumer market, LOCTITE MULTICORE HF 200 is an advanced halogen-free, lead-free solder paste with superior print characteristics.

(LT-6648 - 02/2013)

(.484 MB)

Recognizing the unique requirements of larger printed circuit boards (PCBs) used for many industrial and automotive applications, Henkel has designed a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies.

(LT-6647 - 02/2013)

(1.29 MB)

Loctite Multicore solder materials offer high reliability, superior processability and advanced capability for almost any application.
(LT6645 - 02/2013)

(1.9 MB)

A robust alternative to traditional potting and encapsulation techniques.

(LT-5989 - 05/2010)

(.28 MB)
UV stable low pressure molding encapsulant based on Henkel's polyamide hot melt technology.
(LT-6562 - 06/12)

(1.9 MB)

Henkel is the world’s leading and most progressive provider of qualified materials for semiconductor packaging, printed circuit board (PCB) assembly and advanced soldering solutions.

(LT-6000 - 11/12)

(.977MB)
Henkel’s advanced semiconductor packaging and assembly materials are delivering the solutions needed to address the demanding requirements of nextgeneration medical electronics.

(LT-5892 - 01/2013)

(0.45 MB)

Multicore brand high-performance liquid flux technology is compatible with dual-wave and Pb-free processes, delivering outstanding results. From no-clean to low residue to VOC-free.

(LT4726 - 06/2011)     

(0.82 MB)

Halide-free, no-clean, lead-free solder paste. 

(LT-5837 - 03/2010)

(5.61 MB)

The Multicore portfolio of cored solder wire features the award-winning multiple flux core technology that ensures the even and consistent distribution of flux throughout the solder wire.

(LT-6320 - 04/2011)

(1.56 MB)

Henkel manufactures numerous assembly and protection materials for the demanding requirements of photovoltaic electronics.

(LT-5722 - 02/2011)

(0.43 MB)

Printed inks applications for the electronics industry.

(LT-5980 - 04/2010)

(0.58 MB)

RFID Solutions Adhesives and Inks for RFID Assembly

(LT-5630 - 09/2009)

Low Pressure molding circuit board protection product.
(LT-4182- 05/13)

ECI 5000 E&C Series transparent conductive ink and NCI 9001 E&C protective overcoat dielectric ink.
(LT-6700 - 05/2013)

(0.77 MB)

Thermal Mananagement Materials

(LT-4988 - 05/2012)

(2.6 MB)

Catalog covers Henkel's wide range of solutions for the Semiconductor Industry.

(LT-5013 - 06/2010)

(0.366 MB)
The need to improve device performance while complying with package miniaturization demands is driving flip chip development. Henkel LOCTITE ECCOBOND underfill systems have been specifically designed to meet the demands.
(APH-AE-214 - 03/13)

(.680 MB)

Henkel has developed Ablebond ABP-8000 that addresses the needs of high reliability, small die size and high power lead-frame applications. Ablebond ABP-8000 offers the high adhesion, excellent reliability, outstanding dispensing performance and the highest electrical and thermal conductivity in any organic based system.

(APH-AE-202 - 02/2011)

(.370 MB)

Ablestik conductive die attach films C100 series deliver the electrically conductive and thermally conductive performance. They are also compatible with all clean lead-frame finishes.

(APH-AE-201 - 06/2011)

(0.25 MB)

LOCTITE ABLESTIK CDF 200P is the world's first conductive dicing die attach film (2-in-1, precut format) designed for semiconductor packaging.

(LT-6550 - 06/2012)

(0.49 MB)
The roll out of Henkel's new silver plated copper (SPC) die attach filler technology is one way to control cost without compromising performance by reducing metal content.
(APH-AE-203 - 07/2012)

(5.2 MB)

Thermal management necessary for today’s smaller outline, higher functioning semiconductor power devices.

(LT-6328 - 02/2010)

Henkel's Conductive Dicing Die Attach Film for Multi-Chip Packages or Modules Sell Sheet
(3.28 MB)
Henkel's conductive die attach film technology, available in both roll and precut formats, offers semiconductor specialists the ability to place dies closer together than ever before.
(LT-6551 - 06/2012)

(0.56 MB)

High Performance Dicing Die Attach Films - Enabling Advanced Stacked Die Applications

(LT-4892 - 07/2012)

(4.55 MB)
Emphasizing compatibility between materials from wafer-level to board-level and final assembly, Henkel delivers a complete range of off-the-shelf and custom-developed solutions to respond to every requirement of your specific application.
(APH-AE-205 MC - 06/2011)