(.680 MB)

Henkel has developed Ablebond ABP-8000 that addresses the needs of high reliability, small die size and high power lead-frame applications. Ablebond ABP-8000 offers the high adhesion, excellent reliability, outstanding dispensing performance and the highest electrical and thermal conductivity in any organic based system.

(APH-AE-202 - 02/2011)

(.370 MB)

Ablestik conductive die attach films C100 series deliver the electrically conductive and thermally conductive performance. They are also compatible with all clean lead-frame finishes.

(APH-AE-201 - 06/2011)

(1.8 MB)
The roll out of Henkel's new silver plated copper (SPC) die attach filler technology is one way to control cost without compromising performance by reducing metal content.
(APH-AE-203 - 02/2011)

(0.66 MB)

Henkel Electronic’s revolutionary silver (Ag) sintering technology enables high volume production of modern power packages in a process that does not require pressure.

(06/11)

(5.2 MB)

Thermal management necessary for today’s smaller outline, higher functioning semiconductor power devices.

(LT-6328 - 02/2010)

(3.7 MB)

Defense & Aerospace electronics solutions guide.

(LT-5294 - 04/2010)

(2.85 MB)

Catalog covers Henkel's broad range of PCB Assembly solutions.

(LT-5012 - 01/2012)

(0.56 MB)

High Performance Dicing Die Attach Films - Enabling Advanced Stacked Die Applications

(LT-4892 - 10/2009)

(1.2 MB)

Advanced conformal coating materials protect PCBs from thermal shock, moisture, corrosive materials, and a variety of other adverse conditions.

(LT-4990 - 03/2008)

Low viscosity single component, VOC free conformal coating.

(0.28 MB)


Toluene-Free Acrylic Conformal Coating

(LT-5105 - 06/2008)

(1.3 MB)

Unique hybrid system of epoxy and acrylate to achieve low vicosity, high reliability and good reworkability use of handheld devices.

(LT-5555 - 05/2009)

(3.21 MB)

Industrial applications require materials solutions that can meet the everchanging demands for high reliability and improved performance.

(AE-D01 - 10/2010)

(3.98MB)

Our extended product line covers LED encapsulant, die attach, PCB protection and thermal management materials. High performance inks are also available for applications that dictate a printable solution.

(LT-5427 - 06/2011)

(1.4 MB)

Ultra fast curing, non-corrosive RTV silicone designed for potting, wire tacking, selective sealing, vibration dampening and repair / rework applications on PCBs.

(LT-4993 - 03/2008)

(1.9 MB)

A robust alternative to traditional potting and encapsulation techniques.

(LT-5989 - 05/2010)

(0.20 MB)

Macromelt circuit board protection products.

(LT-4934 - 06/2011)

(1.9 MB)

Henkel is the world’s leading and most progressive provider of qualified materials for semiconductor packaging, printed circuit board (PCB) assembly and advanced soldering solutions.

(LT-6000 - 05/2010)

(1.2 MB)

Henkel’s advanced semiconductor packaging and assembly materials are delivering the solutions needed to address the demanding requirements of next-generation medical electronics.

(LT-5892 - 02/2010)

(4.55 MB)
Emphasizing compatibility between materials from wafer-level to board-level and final assembly, Henkel delivers a complete range of off-the-shelf and custom-developed solutions to respond to every requirement of your specific application.
(APH-AE-205 MC - 06/2011)

(0.53 MB)

Halogen-free, no-clean, lead-free solder paste, which has a broad process window for printing, reflow, humidity resistance and shows minimal hot slump.

(LT-5907 - 05/2010)

(0.45 MB)

Multicore brand high-performance liquid flux technology is compatible with dual-wave and Pb-free processes, delivering outstanding results. From no-clean to low residue to VOC-free.

(LT4726 - 06/2011)     

(0.82 MB)

Halide-free, no-clean, lead-free solder paste. 

(LT-5837 - 03/2010)

(5.61 MB)

The Multicore portfolio of cored solder wire features the award-winning multiple flux core technology that ensures the even and consistent distribution of flux throughout the solder wire.

(LT-6320 - 04/2011)

(1.56 MB)

Henkel manufactures numerous assembly and protection materials for the demanding requirements of photovoltaic electronics.

(LT-5722 - 02/2011)

(0.43 MB)

Printed inks applications for the electronics industry.

(LT-5980 - 04/2010)

(0.58 MB)

RFID Solutions Adhesives and Inks for RFID Assembly

(LT-5630 - 09/2009)

(0.54 MB)

Self-Filleting can potentially be a viable solution for any controlled flow application that would normally require film due to tight tolerances.

(LT-5212 - 02/2009)

(2.6 MB)

Catalog covers Henkel's wide range of solutions for the Semiconductor Industry.

(LT-5013 - 06/2010)

(0.77 MB)

Thermal Mananagement Materials

(LT-4988 - 12/2009)