Electronics Literature


Ablebond ABP-8000

(.680 MB)

Henkel has developed Ablebond ABP-8000 that addresses the needs of high reliability, small die size and high power lead-frame applications. Ablebond ABP-8000 offers the high adhesion, excellent reliability, outstanding dispensing performance and the highest electrical and thermal conductivity in any organic based system.

(APH-AE-202 - 02/2011)


Ablestik C100 Series

(.370 MB)

Ablestik conductive die attach films C100 series deliver the electrically conductive and thermally conductive performance. They are also compatible with all clean lead-frame finishes.

(APH-AE-201 - 06/2011)


Ablestik Silver Plated Copper (SPC)

(1.8 MB)
The roll out of Henkel's new silver plated copper (SPC) die attach filler technology is one way to control cost without compromising performance by reducing metal content.
(APH-AE-203 - 02/2011)


Ablestik SSP2000 Silver Sintering Sell Sheet

(0.66 MB)

Henkel Electronic’s revolutionary silver (Ag) sintering technology enables high volume production of modern power packages in a process that does not require pressure.

(06/11)


DA100 & DA101 Die Attach Solder Paste Sell Sheet

(5.2 MB)

Thermal management necessary for today’s smaller outline, higher functioning semiconductor power devices.

(LT-6328 - 02/2010)


Defense & Aerospace Brochure

(3.7 MB)

Defense & Aerospace electronics solutions guide.

(LT-5294 - 04/2010)


Electronics Assembly Solutions

(2.85 MB)

Catalog covers Henkel's broad range of PCB Assembly solutions.

(LT-5012 - 01/2012)


High Performance Dicing Die Attach Films

(0.56 MB)

High Performance Dicing Die Attach Films - Enabling Advanced Stacked Die Applications

(LT-4892 - 10/2009)


Hysol PC40-UM Sell Sheet

(1.2 MB)

Advanced conformal coating materials protect PCBs from thermal shock, moisture, corrosive materials, and a variety of other adverse conditions.

(LT-4990 - 03/2008)


Hysol PC40-UT Sell Sheet

Low viscosity single component, VOC free conformal coating.


Hysol PC62

(0.28 MB)


Toluene-Free Acrylic Conformal Coating

(LT-5105 - 06/2008)


Hysol UF3800 Underfill Sell Sheet

(1.3 MB)

Unique hybrid system of epoxy and acrylate to achieve low vicosity, high reliability and good reworkability use of handheld devices.

(LT-5555 - 05/2009)


Industrial Electronics Assembly Brochure

(3.21 MB)

Industrial applications require materials solutions that can meet the everchanging demands for high reliability and improved performance.

(AE-D01 - 10/2010)


Lighting Solutions Brochure

(3.98MB)

Our extended product line covers LED encapsulant, die attach, PCB protection and thermal management materials. High performance inks are also available for applications that dictate a printable solution.

(LT-5427 - 06/2011)


Loctite 5210 Sell Sheet

(1.4 MB)

Ultra fast curing, non-corrosive RTV silicone designed for potting, wire tacking, selective sealing, vibration dampening and repair / rework applications on PCBs.

(LT-4993 - 03/2008)


Macromelt OM341 Sell Sheet

(1.9 MB)

A robust alternative to traditional potting and encapsulation techniques.

(LT-5989 - 05/2010)


Macromelt Sell Sheet

(0.20 MB)

Macromelt circuit board protection products.

(LT-4934 - 06/2011)


Materials For Automotive Electronics Applications

(1.9 MB)

Henkel is the world’s leading and most progressive provider of qualified materials for semiconductor packaging, printed circuit board (PCB) assembly and advanced soldering solutions.

(LT-6000 - 05/2010)


Medical Electronics Brochure

(1.2 MB)

Henkel’s advanced semiconductor packaging and assembly materials are delivering the solutions needed to address the demanding requirements of next-generation medical electronics.

(LT-5892 - 02/2010)


Mold Compound Brochure

(4.55 MB)
Emphasizing compatibility between materials from wafer-level to board-level and final assembly, Henkel delivers a complete range of off-the-shelf and custom-developed solutions to respond to every requirement of your specific application.
(APH-AE-205 MC - 06/2011)


Multicore HF108 Solder Paste Sell Sheet

(0.53 MB)

Halogen-free, no-clean, lead-free solder paste, which has a broad process window for printing, reflow, humidity resistance and shows minimal hot slump.

(LT-5907 - 05/2010)


Multicore High Performance Liquid Fluxes

(0.45 MB)

Multicore brand high-performance liquid flux technology is compatible with dual-wave and Pb-free processes, delivering outstanding results. From no-clean to low residue to VOC-free.

(LT4726 - 06/2011)     


Multicore LF620 Solder Paste Sell Sheet

(0.82 MB)

Halide-free, no-clean, lead-free solder paste. 

(LT-5837 - 03/2010)


Multicore Solder Wire Solutions Sell Sheet

(5.61 MB)

The Multicore portfolio of cored solder wire features the award-winning multiple flux core technology that ensures the even and consistent distribution of flux throughout the solder wire.

(LT-6320 - 04/2011)


Multicore WS300 Water Wash Solder Paste Sell Sheet (0.58 MB)
Multicore WS300 is a lead-free, high activity, water washable solder paste with superior cleaning characteristics, and is suitable for high speed, fine pitch printing applications.
(LT-4459 - 04/2011)

Photovoltaic (Solar) Brochure

(1.56 MB)

Henkel manufactures numerous assembly and protection materials for the demanding requirements of photovoltaic electronics.

(LT-5722 - 02/2011)


Printed Electronics Inks Brochure

(0.43 MB)

Printed inks applications for the electronics industry.

(LT-5980 - 04/2010)


RFID Trifold Brochure

(0.58 MB)

RFID Solutions Adhesives and Inks for RFID Assembly

(LT-5630 - 09/2009)


Self-Filleting Sell Sheet

(0.54 MB)

Self-Filleting can potentially be a viable solution for any controlled flow application that would normally require film due to tight tolerances.

(LT-5212 - 02/2009)


Semiconductor Solutions

(2.6 MB)

Catalog covers Henkel's wide range of solutions for the Semiconductor Industry.

(LT-5013 - 06/2010)


Thermal Management Trifold

(0.77 MB)

Thermal Mananagement Materials

(LT-4988 - 12/2009)


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