Electronics Literature


Assembly

Bipax Tra-Bond

Brochure
Japanese-language version of the Bipax Tra-bond brochure.
(L84-1204A — 05/2012)

Defense & Aerospace

Brochure

Defense & Aerospace electronics solutions guide.

(LT-5294 — 04/2010)

Electronics Assembly Solutions

Catalog

Covers Henkel's broad range of PCB Assembly solutions.

(LT-5012 — 01/2012)

Electronic Solutions for the Photovoltaic Industry

Brochure

Henkel manufactures numerous assembly and protection materials for the demanding requirements of photovoltaic electronics.

(LT-5722 — 02/2011)

Henkel Flexible Printed Circuit

Brochure
These material solutions along with Henkel's full suite of FPCB technologies, are delivering the adaptability and performance required for modern flex circuit manufacturing.
(APH-AE-210 — 07/2012)

Henkel's Innovative Adhesive Solutions

Product Fact Sheet
Henkel’s preform LOCTITE ABLESTIK brand adhesive films address the requirements of today’s demanding applications. Preform film parts from the Global leader in adhesives.
(LT-6587 — 09/2012)

High Reliability Pb-Free Solder Alloy (90iSC)

Brochure

Henkel’s solder alloy, 90iSC, is the solution to various market segments that require high reliability with RoHS compliance.

(LT-6649 — 02/2013)

HYSOL PC40-UM

Product Fact Sheet

Advanced conformal coating materials protect PCBs from thermal shock, moisture, corrosive materials, and a variety of other adverse conditions.

(LT-4990 — 03/2008)

HYSOL PC62

Product Fact Sheet

Toluene-Free Acrylic Conformal Coating

(LT-5105 — 06/2008)

HYSOL UF3800 Underfill

Product Fact Sheet

Unique hybrid system of epoxy and acrylate to achieve low vicosity, high reliability and good reworkability use of handheld devices.

(LT-5555 — 03/2013)

Industrial Electronics Assembly

Brochure

Industrial applications require materials solutions that can meet the everchanging demands for high reliability and improved performance.

(AE-D01 — 10/2010)

Lighting Solutions

Brochure

Our extended product line covers LED encapsulant, die attach, PCB protection and thermal management materials. High performance inks are also available for applications that dictate a printable solution.

(LT-5427 — 06/2011)

LOCTITE 5210

Product Fact Sheet

Ultra fast curing, non-corrosive RTV silicone designed for potting, wire tacking, selective sealing, vibration dampening and repair / rework applications on PCBs.

(LT-4993 — 03/2013)

LOCTITE ABLESTIK ICP 4000 Series

Brochure
ICP 4000, ICP 4001, ICP 4298
Electrically Conductive Silicones for High Operating Temperatures
(AE13005 — 03/2013)    

LOCTITE Bar Solder

Product Fact Sheet

The LOCTITE portfolio of bar solder offers both Sn-Pb and Pb-free industry standard alloys.  Dross Recovery Program and Solder Analysis are also available.

(LT-6778 — 2/2014)

LOCTITE ECCOBOND E 1216M CSP/BGA Underfill

Product Fact Sheet
High reliability underfill that delivers fast flow and fast cure capabilities
(LT-6876 — 1/2014)

LOCTITE ECCOBOND EN 3810T and EN 3838T

Product Fact Sheet
Both materials are primarily designed for encapsulating components on a circuit board.
(LT-6903 — 03/2014)

LOCTITE ECCOBOND UF 3811

Product Fact Sheet
Reworkable epoxy underfill for Chip-Scale Package (CSP) and Ball Grid Array (BGA) applications.
(LT-6894 — 03/2014)

LOCTITE ECCOBOND UV 9060F

Product Fact Sheet

Fluorescent, no flow, UV/moisture cure encapsulant designed for local circuit board protection.
(LT-6809 – 02/2014)

LOCTITE ECI 1004 E&C

Product Fact Sheet

Halogen-free, electrically conductive ink with fine-line printing capabilities
(LT-6701 – 06/2013)

LOCTITE ECI 8000 E&C Series

Product Fact Sheet
Self regulating, thermally conductive printable ink for heating applications
(LT-6875 — 1/2014)

LOCTITE MULTICORE HF 108RFW

Product Fact Sheet
Halogen-free, no-clean and low-voiding, LOCTITE MULTICORE HF 108RWF is a high performance reworkable flux formulated not only for rework, but also for technology build processes such as laser soldering.
(LT-6650 — 02/2013)

LOCTITE MULTICORE HF 200

Product Fact Sheet

Formulated for miniaturized assemblies that define today’s consumer market, LOCTITE MULTICORE HF 200 is an advanced halogen-free, lead-free solder paste with superior print characteristics.

(LT-6648 — 02/2013)

LOCTITE HF 212

Product Fact Sheet

Halogen-free solder paste that withstands the thermal demands inherent with larger assemblies.

(LT-6647 — 10/2013)

LOCTITE MULTICORE HF 250DP

Product Fact Sheet
Designed for high accuracy dispensing operations, LOCTITE MULTICORE HF 250DP is a robust type 5, halogen-free, lead-free, low-voiding solder paste with outstanding dispense characteristics.
(LT-6646 — 02/2013)   

LOCTITE Solder Wire Solutions

Product Fact Sheet

The LOCTITE® portfolio of cored solder wire, formerly known as MULTICORE, features the award-winning multiple flux core technology.

(LT-6320 — 12/2013)

LOCTITE PC 40-UMF

Product Fact Sheet
Conformal coating specially formulated to gel rapidly and immobilize when exposed to UV light, then fully cure when exposed to atmospheric moisture.
(LT-6863 — 2/2014)

LOCTITE TAF Series

Product Fact Sheet

High performance heat absorbing and spreading film
(LT-6757 – 06/2013)

LOCTITE UF3810 CSP/BGA Underfill

Product Fact Sheet
Unique epoxy hybrid system to achieve low viscosity, high reliability and complete reworkability for use on PoP, WLCSP and CSP devices.
(LT-4988 — 05/2012)

LOCTITE UV 9052

Product Fact Sheet
One-component, UV/moisture-cure adhesive designed as an encapsulant for sensitive electronic components.
(LT-6820 — 2/2014)

MACROMELT OM648 Circuit Board Protection Product

Product Fact Sheet
UV stable low pressure molding encapsulant based on Henkel's polyamide hot melt technology.
(LT-6562 — 06/2012)

Materials for Automotive Electronic Applications

Brochure

Henkel has developed a broad range of products to address the needs of today’s advanced automotive industry

(APH-AE-220 -- 02/2014)
Medical Electronics

Brochure
Henkel’s advanced semiconductor packaging and assembly materials are delivering the solutions needed to address the demanding requirements of next-generation medical electronics.

(LT-5892 — 01/2013)

MULTICORE High Performance Liquid Fluxes

Product Fact Sheet

MULTICORE brand high-performance liquid flux technology is compatible with dual-wave and Pb-free processes, delivering outstanding results. From no-clean to low residue to VOC-free.

(LT-4726 — 06/2011)     

MULTICORE LF620 Solder Paste

Product Fact Sheet

Halide-free, no-clean, lead-free solder paste. 

(LT-5837 — 03/2010)

MULTICORE WS300 Water Wash Solder Paste

Product Fact Sheet
MULTICORE WS300 is a lead-free, high activity, water washable solder paste with superior cleaning characteristics, and is suitable for high speed, fine pitch printing applications.
(LT-4459 — 04/2011)

Printed Circuit Board Protection Brochure
Henkel’s broad portfolio of printed circuit board
protection materials safeguards electronic components
and printed circuit boards (PCBs) from damaging
environmental factors.
(LT-6917 -- 03/2014)
Printed Electronics Inks

Brochure

Printed inks applications for the electronics industry.

(LT-5980 — 10/2013)

RFID Solutions Adhesives & Inks for RFID Assembly

Brochure

Henkel's robust line of RFID materials ensures reliable in-field performance.

(LT-5630 — 09/2009)

Solder Materials Solutions Guide

Brochure

LOCTITE MULTICORE solder materials offer high reliability, superior processability and advanced capability for almost any application.
(LT-6645 — 02/2013)

Solutions Across the Board

Brochure
Henkel is the world’s leading and most progressive provider of qualified materials for printed circuit board (PCB) assembly and advanced soldering solutions.
(LT-6644 — 01/2013)

Technomelt Electronics

Catalog

Low pressure molding solutions.

(LT-4182 — 08/2013)

Technomelt PA 341

Product Fact Sheet

A robust alternative to traditional potting and encapsulation techniques.

(LT-5989 — 10/2013)

Thermal Management Materials

Brochure

Henkel's unique and user friendly products address the demands of today's thermal transfer requirements.

(LT-4988 — 12/2013)

Transparent and Dielectric Inks

Brochure

ECI 5000 E&C Series transparent conductive ink and NCI 9001 E&C protective overcoat dielectric ink.
(LT-6700 — 05/2013)

Semiconductor

ABLEBOND ABP-8000

Product Fact Sheet

Henkel has developed Ablebond ABP-8000 that addresses the needs of high reliability, small die size and high power lead-frame applications. Ablebond ABP-8000 offers the high adhesion, excellent reliability, outstanding dispensing performance and the highest electrical and thermal conductivity in any organic based system.

(APH-AE-202 — 02/2011)

ABLESTIK C100 Series

Product Fact Sheet

Ablestik conductive die attach films C100 series deliver the electrically conductive and thermally conductive performance. They are also compatible with all clean lead-frame finishes.

(APH-AE-201 — 06/2011)

ABLESTIK CDF 200P

Product Fact Sheet

LOCTITE ABLESTIK CDF 200P is the world's first conductive dicing die attach film (2-in-1, precut format) designed for semiconductor packaging.

(LT-6550 — 06/2012)

ABLESTIK Silver Plated Copper (SPC)

Product Fact Sheet
The roll out of Henkel's new silver plated copper (SPC) die attach filler technology is one way to control cost without compromising performance by reducing metal content.
(APH-AE-203 — 07/2012)

Conductive Die Attach Films (CDAF)

Brochure
Henkel's line of innovative conductive die attach films (CDAF) that enable more capable and cost-effective lead frame package designs.
(LT-6901 — 03/2014)

DA100 & DA101 Die Attach Solder Paste

Product Fact Sheet

Thermal management necessary for today’s smaller outline, higher functioning semiconductor power devices.

(LT-6328 — 02/2010)

Henkel's Conductive Dicing Die Attach Film

Product Fact Sheet
Henkel's conductive die attach film technology, available in both roll and precut formats, offers semiconductor specialists the ability to place dies closer together than ever before.
(LT-6551 — 06/2012)

High Performance Dicing Die Attach Films

Brochure

High Performance Dicing Die Attach Films - Enabling Advanced Stacked Die Applications

(LT-4892 — 07/2012)

LOCTITE® ABLESTIK ATB Series

Brochure

High-performance dicing die attach films for advanced die stacking applications

(APH-AE-219 -- 02/2014)

LOCTITE ABLESTIK CDF 800P

Product Fact Sheet
The next generation of Henkel’s award-winning pre-cut (2-in-1) conductive die attach film. Designed for high electrical and thermal die attach application in semiconductor packages.
(APH-AE-213 — 03/2013)

LOCTITE ABLESTIK SSP 2020 Silver Sintering

Product Fact Sheet
Ag-based material that delivers a robust intermetallic bond between targeted surfaces, the substrate and die, via a pressureless or pressure sintering process.
(LT-6758 – 06/2013)

Micro-Electro-Mechanical Systems (MEMS)

Brochure

Henkel's full portfolio of materials for varying processes from die attach to underfill to lid attach and glob top, commercialized, proven materials.
(LT-6742 – 06/2013)

Mold Compound

Brochure
Emphasizing compatibility between materials from wafer-level to board-level and final assembly, Henkel delivers a complete range of off-the-shelf and custom-developed solutions to respond to every requirement of your specific application.
(APH-AE-205 MC — 06/2011)

Semiconductor Solutions

Catalog

Covers Henkel's wide range of solutions for the Semiconductor Industry.

(LT-5013 — 06/2010)

Semiconductor Underfills Solutions

Catalog
The need to improve device performance while complying with package miniaturization demands is driving flip chip development. Henkel LOCTITE ECCOBOND underfill systems have been specifically designed to meet the demands.
(APH-AE-214 — 03/2013)

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