Solder Materials Science Gets Small as Miniaturization Challenges Old Rules
-Neil Poole, Ph.D. and Brian Toleno, Ph.D.
When considering which thermal management materials are the right products for the task, top-of-mind are usually greases, pastes or pads. Are they always the best solution, though, or just the most well known?
- Art Ackerman and Jason Brandi
Lead-free for High-reliability, High-temperature Applications
-Hector Steen, Ph.D. and Brian Toleno, Ph.D.
Mechanical stress in flip-chip (FC) assemblies
-Robert L. Hubbard, Pierino Zappella, Pukun Zhu
Epoxy Flux Technology – Tacky Flux with Value Added Benefits
-Bruce Chan, Qing Ji, Mark Currie, Nil Poole, C.T. Tu
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Advancements In Packaging Technology Driven By Global Market Return
-M. G. Todd