White Papers


Solder Materials Science Gets Small

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules
-Neil Poole, Ph.D. and Brian Toleno, Ph.D.

                                                                          Download White Paper

Reliability that Sticks: Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format

When considering which thermal management materials are the right products for the task, top-of-mind are usually greases, pastes or pads. Are they always the best solution, though, or just the most well known?
 - Art Ackerman and Jason Brandi
                                                                          Download White Paper

Lead-free for High-reliability

Lead-free for High-reliability, High-temperature Applications
-Hector Steen, Ph.D. and Brian Toleno, Ph.D.

                                                                          Download White Paper

Flip-Chip Process Improvements for Low Warpage

Mechanical stress in flip-chip (FC) assemblies
-Robert L. Hubbard, Pierino Zappella, Pukun Zhu

                                                                          Download White Paper

Epoxy Flux Technology

Epoxy Flux Technology – Tacky Flux with Value Added Benefits
-Bruce Chan, Qing Ji, Mark Currie, Nil Poole, C.T. Tu

                                                                          Download White Paper

Advancements In Packaging Technology

Advancements In Packaging Technology Driven By Global Market Return
-M. G. Todd

                                                                          Download White Paper