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Solder Materials Science Gets Small

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules

-Neil Poole, Ph.D. and Brian Toleno, Ph.D.
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Reliability that Sticks: Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format

When considering which thermal management materials are the right products for the task, top-of-mind are usually greases, pastes or pads. Are they always the best solution, though, or just the most well-known?
- Art Ackerman and Jason Brandi

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Lead-free for High-reliability

Lead-free for High-reliability, High-temperature Applications
-Hector Steen, Ph.D. and Brian Toleno, Ph.D.
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Flip-Chip Process Improvements for Low Warpage

Mechanical stress in flip-chip (FC) assemblies
-Robert L. Hubbard, Pierino Zappella, Pukun Zhu
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Epoxy Flux Technology

Epoxy Flux Technology – Tacky Flux with Value Added Benefits
-Bruce Chan, Qing Ji, Mark Currie, Nil Poole, C.T. Tu
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Advancements In Packaging Technology

Advancements In Packaging Technology Driven By Global Market Return
-M. G. Todd
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