ABLESTIK ABLEBOND 2035SC-1B1
ABLESTIK ABLEBOND non-conductive, one component die attach adhesive was formulated for high throughput die attach applications. It is designed for die attach applications requiring good dielectric layer. Designed to minimize stress and resulting warpage between dissimilar surfaces. It is the 20 µm bondline version of ABLEBOND 2035SC adhesive.
| Applications |
Adhesives >
Die Attach Adhesives Adhesives > Die Attach Adhesives, Electrically Non-Conductive > Laminate Packages, Electrically Non-Conductive Paste |
| Chemistry |
Acrylic |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
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Ablestik Ablebond 2035SC-1B1 'Non-Conductive Adhesive for High Throughput and Controlled Bondline Die Attach Applications'
|
PDF
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Product information
| IDH# | Item | Name | Size |
|
| 1636862 | 1636862 | ABLESTIK ABLEBOND 2035SC-1B1 |
42.0 g
|
