ABLESTIK ABP-8000 conductive die attach is desgined for bonding devices where high heat transfer is required. It is recommended for use in the attachment of integrated circuits and components onto metallic leadframes. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
Die Attach Adhesives, Electrically Conductive >
Leaded Packages, Electrically Conductive Paste
|Media Carrier||100 % liquid & paste|
|Cure Type||Heat cure|
|RoHS Compliant||Contact Henkel|
Technical Data Sheets (TDS)