ABLESTIK ABP-8000 conductive die attach is desgined for bonding devices where high heat transfer is required.  It is recommended for use in the attachment of integrated circuits and components onto metallic leadframes. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.

Applications Adhesives > Die Attach Adhesives, Electrically Conductive > Leaded Packages, Electrically Conductive Paste
Chemistry Bismaleimide
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Ablestik Ablestik ABP-8000 'Conductive Die Attach Adhesive'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1572430 1572430 Ablestk ABP-8000