ABLESTIK ACP-3122
ABLESTIK ACP-3122 anisotropic epoxy adhesive is designed for high throughput microelectronics assembly applications. This adhesive conducts in only one direction, making it suitable for small die and component attachment without the possibillity of electrical shorting. ACP-3122 requires pressure during cure to establish a reliable interconnect.
| Applications |
Adhesives >
Electrically Conductive Adhesives >
Snap Cure |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 437488 | 437488 | ABLESTIK ACP-3122 |
5.0 cc
|
