ABLESTIK ICP-3535M1 electrically conductive adhesive is designed for circuit assembly applications.  It is specially recommended for mounting lower cost tin (Sn) finished components onto the conductive trace terminations of printed circuit boards or co-fired ceramic circuitry.  Designed for applications with small size components (0603, 0402) where no bleeding or wicking is tolerated.  It can be applied by stencil printing.

Applications Adhesives > Electrically Conductive Adhesives > Heat Cure
Adhesives > Electrically Conductive Adhesives > Solder Alternative Electrically Conductive Paste
Chemistry Electrically Conductive Paste
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Ablestik Ablestik ICP-3535M1 'Epoxy Adhesive'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1525232 1525232 ABLESTIK ICP-3535M1
10.0 cc  
1526312 1526312 ABLESTIK ICP3535M1
50.0 gm