ABLESTIK ICP-3535M1
ABLESTIK ICP-3535M1 electrically conductive adhesive is designed for circuit assembly applications. It is specially recommended for mounting lower cost tin (Sn) finished components onto the conductive trace terminations of printed circuit boards or co-fired ceramic circuitry. Designed for applications with small size components (0603, 0402) where no bleeding or wicking is tolerated. It can be applied by stencil printing.
| Applications |
Adhesives >
Electrically Conductive Adhesives >
Heat Cure Adhesives > Electrically Conductive Adhesives > Solder Alternative Electrically Conductive Paste |
| Chemistry |
Electrically Conductive Paste |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1525232 | 1525232 | ABLESTIK ICP-3535M1 |
10.0 cc
|
|
| 1526312 | 1526312 | ABLESTIK ICP3535M1 |
50.0 gm
|
