Ablestik 8008MD

Adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process. This material was originally released as RP-825-3C1.


Applications Adhesives > Die Attach Adhesives, Electrically Conductive > Leaded Packages, Electrically Conductive Paste
Chemistry Epoxy based
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Ablestik Ablestik 8008MD 'Die attach adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1322194 8008md Ablestik 8008MD