Adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process. This material was originally released as RP-825-3C1.
Die Attach Adhesives, Electrically Conductive >
Leaded Packages, Electrically Conductive Paste
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Technical Data Sheets (TDS)