Ablestik ABLEBOND 2000B

Electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.


Applications Adhesives > Die Attach Adhesives, Electrically Conductive > Laminate Packages, Electrically Conductive Paste
Chemistry Epoxy based
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Ablestik Ablebond 2000B 'Electrically Conductive Die Attach Adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity		 Material Safety Data Sheets
1200680 ablebond2000b Ablestik ABLEBOND 2000B
 


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