Ablestik ABLEBOND 2030SC
Die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes.
Die Attach Adhesives, Electrically Conductive >
Laminate Packages, Electrically Conductive Paste
|RoHS Compliant||Contact Henkel|
Technical Data Sheets (TDS)
|1201577||ablebond2030sc||Ablestik ABLEBOND 2030SC||