Ablestik ABLEBOND 2033SC
Die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries.
| Applications |
Adhesives >
Die Attach Adhesives, Electrically Non-Conductive >
Laminate Packages, Electrically Non-Conductive Paste |
| Chemistry |
Epoxy based |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1190253 | ablebond2033sc | Ablestik ABLEBOND 2033SC |
|
