Ablestik ABLEBOND 2033SC

Die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries.


Applications Adhesives > Die Attach Adhesives, Electrically Non-Conductive > Laminate Packages, Electrically Non-Conductive Paste
Chemistry Epoxy based
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Ablestik Ablestik Ablebond 2033SC 'Die attach adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1190253 ablebond2033sc Ablestik ABLEBOND 2033SC