Ablestik ABLEBOND 3003

Ablebond 3003 adhesive is designed for lid attach in flip chip BGA applications. The combination of product features result in superior flip chip BGA reliability. This material is sensitive to amines, phosphorus, sulfur and tin containing components.


Applications Potting & Encapsulating > Lid Attach
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Ablestik Ablebond 3003 'Die attach applications'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1200858 425938 Ablestik ABLEBOND 3003 10cc EFD W/WP/Snap Cap (15g)
 
1201280 428267 Ablestik ABLEBOND 3003 5cc/10cc EFD W/WP/Snap Cap(7.5g)
 
1201860 431164 Ablestik ABLEBOND 3003, 10cc Musashi /TPP-E/HC-C/
 
1202150 432387 Ablestik ABLEBOND 3003 5cc EFD W/WP/Snap Cap (7.5g)
 
1202584 433743 Ablestik ABLEBOND 3003, 15cc/30cc EFD W/WP/Snap Cap
 
1202614 433803 Ablestik ABLEBOND 3003 30cc Musashi /MLP-E/HC-E/ (45g)
 
1202979 434516 Ablestik ABLEBOND 3003(65g), 50cc Musashi /FLP-E/
 
1203223 434890 Ablestik ABLEBOND 3003 (65g),50cc Musashi /FLP-E/H
 
1203497 435310 Ablestik ABLEBOND 3003, 12 oz Cartridge