Ablestik ABLEBOND 8387B
Non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast cured using directed heat energy energy or hot plate curing techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC.
| Applications |
Adhesives >
Die Attach Adhesives, Electrically Conductive >
Laminate Packages, Electrically Conductive Paste Adhesives > Photonics Adhesives > Image Sensor & Camera Module Assembly, Thermal Cure |
| Chemistry |
Epoxy based |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1201927 | ablebond8387b | Ablestik ABLEBOND 8387B |
|
