Ablestik ABLEBOND 8387B

Non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast cured using directed heat energy energy or hot plate curing techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC.


Applications Adhesives > Die Attach Adhesives, Electrically Conductive > Laminate Packages, Electrically Conductive Paste
Adhesives > Photonics Adhesives > Image Sensor & Camera Module Assembly, Thermal Cure
Chemistry Epoxy based
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Ablestik Ablestik Ablebond 8387B 'nonconductive die attach adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1201927 ablebond8387b Ablestik ABLEBOND 8387B