Ablestik ABLEBOND 84-1A

Adhesive for high volume semiconductor applications. This paste adhesive is ideal for application by printing, dispensing or stamping.


Applications Adhesives > Die Attach Adhesives
Adhesives > Die Attach Adhesives, Electrically Conductive
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Ablestik Ablestik Ablebond 84-1A 'Adhesive for high volume semiconductor packaging applications'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1199243 1199243 Ablestik ABLEBOND 84-1A, One Pound Jar
 
1199244 1199244 Ablestik ABLEBOND 84-1A, 10cc Techcon Syringe
 
1199264 1199264 Ablestik ABLEBOND 84-1A, 4 oz Jar
 
1199608 1199608 Ablestik ABLEBOND 84-1A, 8 oz Jar
 
1199657 1199657 Ablestik ABLEBOND 84-1A, 1 oz Jar
 
1200004 1200004 Ablestik ABLEBOND 84-1A, 5CC EFD W/WHITE PISTON
 
1200014 1200014 Ablestik ABLEBOND 84-1A, 5CC/10CC EFD w/ white piston/SNAP CAP
 
1276557 1276557 Ablestik ABLEBOND 84-1A, 3cc/5cc EFD w/ white piston/Snap Cap
 
1276656 1276656 Ablestik ABLEBOND 84-1A, 5cc Musashi /TPP-E/HC-C/GT
 
1276792 1276792 Ablestik ABLEBOND 84-1A, 30cc EFD w/White Piston/Snap Cap
 
1290273 1290273 Ablestik ABLEBOND 84-1A, 3cc EFD w/ white piston/Snap Cap
 
1324156 1324156 Ablestik ABLEBOND 84-1A, 5cc/6cc Techcon Syr.
 
1199865 415422 Ablestik ABLEBOND 84-1A, 10CC EFD W/WHITE PISTON