Ablestik ABLEBOND 84-1LMIT1
Fast, low temperature cure electrically & thermally conductive adhesive. Ideally suited for low stress die & component attaching, this adhesive has a unique silver particle size allowing very thin bond lines.
| Applications |
Adhesives >
Electrically Conductive Adhesives Adhesives > Electrically Conductive Adhesives > Heat Cure |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
| Product Note | Contact Customer Service for ordering information. |
