Ablestik ABLEBOND 84-3
Exceptionally low thermal resistance. Superior contact resistance and adhesion stability on Sn, SnPb and OSP Cu. Very low weight loss & bleed during cure.
| Applications |
Adhesives >
Electrically Non-Conductive Adhesives >
General |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
| Product Note | Contact Customer Service for ordering information. |
