Ablestik ABLEBOND 8700K

High thermal conductivity, low temperature curing, microelectronics grade adhesive.


Applications Adhesives > Electrically Non-Conductive Adhesives
Adhesives > Thermally Conductive Adhesives > Non-Shimming Adhesives
Adhesives > Thermally Conductive Adhesives > Thermally Conductive Paste
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel
Product Note Contact Customer Service for ordering information.

Technical Data Sheets (TDS)

Ablestik Ablebond 8700K 'Die attach adhesive'
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