Ablestik ABLEBOND 8700K
High thermal conductivity, low temperature curing, microelectronics grade adhesive.
| Applications |
Adhesives >
Electrically Non-Conductive Adhesives Adhesives > Thermally Conductive Adhesives > Non-Shimming Adhesives Adhesives > Thermally Conductive Adhesives > Thermally Conductive Paste |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
| Product Note | Contact Customer Service for ordering information. |
