Ablestik ABLEFILL UF8807
One component, high flow liquid underfill encapsulant with superior moisture resistance.
| Applications |
Adhesives >
Underfills >
CSP Underfill, Flip Chip on Flex & Flip Chip-on-Board |
| Chemistry |
Underfill - capillary flow |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1201347 | 1201347 | Ablestik ABLEFILL UF8807, 30CC EFD w/ white piston/Snap Cap/BTC |
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| 1201348 | 428632 | Ablestik ABLEFILL UF8807, 10CC EFD w/ white piston/Snap Cap/BTC |
|
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| 1201451 | 429421 | Ablestik ABLEFILL UF8807, 5CC/10CC EFD w/ white piston/Snap Cap/BTC |
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