Ablestik ABLEFILL UF8829
Ablestik UF8829 is for small die in lead-free and low k applications. Higher modulus, lowest CTE.
| Applications |
Adhesives >
Underfills >
Pb-Free Packages Capillary |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
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| 1202247 | 432662 | Ablestik ABLEFILL UF8829,10ccEFD W/WP/Snap Cap (15g), |
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| 1202352 | 433031 | Ablestik ABLEFILL UF8829, 5cc EFD W/WP/Snap Cap |
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| 1202832 | 434272 | Ablestik ABLEFILL UF8829, 30cc EFD W/WP/Snap Cap (45g), |
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| 1204810 | 437080 | Ablestik ABLEFILL UF8829, 11ARE10130D'A', 30cc EFD (45g), |
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