Ablestik ABLEFILL UF8829

Ablestik UF8829 is for small die in lead-free and low k applications. Higher modulus, lowest CTE.


Applications Adhesives > Underfills > Pb-Free Packages Capillary
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Ablestik Ablefill UF8829 'Moisture resistant underfill encapsulant'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1202247 432662 Ablestik ABLEFILL UF8829,10ccEFD W/WP/Snap Cap (15g)
 
1202352 433031 Ablestik ABLEFILL UF8829, 5cc EFD W/WP/Snap Cap
 
1202832 434272 Ablestik ABLEFILL UF8829, 30cc EFD W/WP/Snap Cap (45g)
 
1204810 437080 Ablestik ABLEFILL UF8829, 11ARE10130D'A', 30cc EFD (45g)