Ablestik ABP-2501

Ablestik ABP-2501 die attach adhesive has been formulated for use in high throughput die bonding applications.  This material is designed to minimize stress and resulting warpage between dissimilar surfaces. Used in smart card applications.


Chemistry Bismaleimide
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Ablestik Loctite Ablestik ABP 2501 'Die attach adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1583349 1583349 Ablestik ABP-2501
13.0 gm syringe