Ablestik ATB-105US
Adhesive film (5 µm) is formulated for use in wafer lamination processess and preform decal. It is designed for use in both mother/daughter die in stack packages.
| Applications |
Adhesives >
Die Attach Adhesives Adhesives > Die Attach Adhesives, Electrically Non-Conductive > DDF DAX, Electrically Non-Conductive Film |
| Chemistry |
Epoxy based |
| RoHS Compliant | Contact Henkel |
| IDH# | Item | Name | Size |
|
| atb-105us_idh | atb-105us | Ablestik ATB-105US |
|
