Ablestik ATB-105US

Adhesive film (5 µm) is formulated for use in wafer lamination processess and preform decal. It is designed for use in both mother/daughter die in stack packages.


Applications Adhesives > Die Attach Adhesives
Adhesives > Die Attach Adhesives, Electrically Non-Conductive > DDF DAX, Electrically Non-Conductive Film
Chemistry Epoxy based
RoHS Compliant Contact Henkel

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
atb-105us_idh atb-105us Ablestik ATB-105US