Ablestik ATB-F100E

ABLESTIK ATB-F100E adhesive film is formulated for use in water lamination processes and preform decal. It is designed for use in both mother/daughter die stack packages.


Applications Adhesives > Die Attach Adhesives, Electrically Non-Conductive > DDF DA1, Electrically Non-Conductive Film
Adhesives > Die Attach Adhesives, Electrically Non-Conductive > DDF DAX, Electrically Non-Conductive Film
Chemistry Epoxies
Media Carrier 100 % solid (incl. Hot Melt)
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Ablestik Ablestik ATB-F100E 'UV Dicing Tape for Chip Stack Packages'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1621788 1621788 Ablestik ATB-F100E
bulk