HYSOL 3508NH is a one-component, reflow curable, halogen free epoxy designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. It can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser.

Applications Adhesives > Underfills > Reworkable CSP Underfill, Capillary Flow
Chemistry Epoxies
Media Carrier 100 % liquid & paste
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol 3508NH 'Epoxy'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1387906 1387906 HYSOL 3508NH
30.0 ml