HYSOL 3508NH
HYSOL 3508NH is a one-component, reflow curable, halogen free epoxy designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. It can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser.
| Applications |
Adhesives >
Underfills >
Reworkable CSP Underfill, Capillary Flow |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1387906 | 1387906 | HYSOL 3508NH |
30.0 ml
|
