HYSOL E1216M is a snap curable capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that cures in a a single reflow cycle. It is stable enough to be easily shipped and used in large volume cartridges up to 20 oz. It is used in CSP, BGA and Flip Chip BGA applications. It is specifically formulated to eliminate anhydride-type curing agents for those who prefer to work with anhydride-free products.
Reworkable CSP Underfill, Other
|Media Carrier||100 % liquid & paste|
|Cure Type||Heat cure|
|RoHS Compliant||Contact Henkel|
Technical Data Sheets (TDS)