HYSOL E1216M is a snap curable capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that cures in a a single reflow cycle.  It is stable enough to be easily shipped and used in large volume cartridges up to 20 oz. It is used in CSP, BGA and Flip Chip BGA applications.  It is specifically formulated to eliminate anhydride-type curing agents for those who prefer to work with anhydride-free products.

Applications Adhesives > Underfills > Reworkable CSP Underfill, Other
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond E1216M 'Capillary Underfill'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1636425 1636425 HYSOL E1216M
30.0 cc