HYSOL ECCOBOND 2332-17 is a solventless one component epoxy adhesive that develops high bond strength when cured at temperatures as low as 100 to 130°C.  It combines flexibility at low temperatures plus high peel and tensile shear strength over a broad temperature range.

Applications Adhesives
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond 2332-17 'One Component, Low Temperature Curing High Strength Epoxy Adhesive'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1189741 1189741 HYSOL ECCOBOND 2332-17
500.0 g  
1189744 1189744 HYSOL ECCOBOND 2332-17
30.0 g