HYSOL ECCOBOND 2332-17
HYSOL ECCOBOND 2332-17 is a solventless one component epoxy adhesive that develops high bond strength when cured at temperatures as low as 100 to 130°C. It combines flexibility at low temperatures plus high peel and tensile shear strength over a broad temperature range.
| Applications |
Adhesives |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
|
Hysol Eccobond 2332-17 'One Component, Low Temperature Curing High Strength Epoxy Adhesive'
|
PDF
|
Product information
| IDH# | Item | Name | Size |
|
| 1189741 | 1189741 | HYSOL ECCOBOND 2332-17 |
500.0 g
|
|
| 1189744 | 1189744 | HYSOL ECCOBOND 2332-17 |
30.0 g
|
