HYSOL ECCOBOND E3526-5
HYSOL ECCOBOND E3526-5 is especially developed for ferrite core bonding applications. It is formulated to have high bond strength when cured at temperatures as low as 100 to 120°C. When used as a potting compound, it is recommended not to exceed a volume of 30cc to avoid exothermic reaction. It is a better flow version than ECCOBOND E3526 adhesive.
|Media Carrier||100 % liquid & paste|
|Cure Type||Heat cure|
|RoHS Compliant||Contact Henkel|
Technical Data Sheets (TDS)
|1189770||1189770||HYSOL ECCOBOND CE3526-5||