HYSOL ECCOBOND E3526-5
HYSOL ECCOBOND E3526-5 is especially developed for ferrite core bonding applications. It is formulated to have high bond strength when cured at temperatures as low as 100 to 120°C. When used as a potting compound, it is recommended not to exceed a volume of 30cc to avoid exothermic reaction. It is a better flow version than ECCOBOND E3526 adhesive.
| Applications |
Adhesives |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1189770 | 1189770 | HYSOL ECCOBOND CE3526-5 |
375.0 g
|
