HYSOL ECCOBOND E3526-5 is especially developed for ferrite core bonding applications. It is formulated to have high bond strength when cured at temperatures as low as 100 to 120°C.  When used as a potting compound, it is recommended not to exceed a volume of 30cc to avoid exothermic reaction.  It is a better flow version than ECCOBOND E3526 adhesive.

Applications Adhesives
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Eccobond E3526-5 'One Part, Fast Curing, Heat Resistant Epoxy Adhesive '

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1189770 1189770 HYSOL ECCOBOND CE3526-5
375.0 g