HYSOL FP4655 is a high performance encapsulant which can be used alone or as a cavity fill material, or in combination with FP4451 material as  part of a dam and fill system.  Its low viscosity and fine particle filler size make it ideal for devices with fine pitch wire spacing. 

Applications Potting & Encapsulating > Low Stress Encapsulants
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol FP4655 'Cavity Fill Adhesive'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1618639 1618639 HYSOL FP4655
10.0 cc