HYSOL FP4655
HYSOL FP4655 is a high performance encapsulant which can be used alone or as a cavity fill material, or in combination with FP4451 material as part of a dam and fill system. Its low viscosity and fine particle filler size make it ideal for devices with fine pitch wire spacing.
| Applications |
Potting & Encapsulating >
Low Stress Encapsulants |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1618639 | 1618639 | HYSOL FP4655 |
10.0 cc
|
