HYSOL GR15F-A
HYSOL GR15F-A anhydride cured molding compound is formulated to contain spherical fillers. It is designed to achieve JEDEC level 1 requirements. It is a green product, used in DIP, SOT, DPAK, Axial Package, bridge package, power discrete and high voltage rectifier applications.
| Applications |
Molding Compounds >
Semiconductor Molding Compounds >
Through-Hole Discretes, High Voltage Applications Molding Compounds > Semiconductor Molding Compounds > Green Molding Compounds |
| Chemistry |
Epoxies |
| Media Carrier | 100 % solid (incl. Hot Melt) |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1583143 | 1583143 | HYSOL GR15F-A |
15.0 kg
|
