HYSOL KL-1000-3LXP
HYSOL KL-1000-3LXP provides the lowest cost of ownership with superior moldability and reliability. Bridge Package, Axial Package and TO are typical package applications.
| Applications |
Molding Compounds >
Semiconductor Molding Compounds >
Through-Hole Discretes Molding Compounds > Semiconductor Molding Compounds > Non-Green Molding Compounds |
| Chemistry |
Epoxies |
| Media Carrier | 100 % solid (incl. Hot Melt) |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
