HYSOL KL-G800H CD

HYSOL KL-G800H CD  is a green epoxy molding compound suitable for thin leaded packages.  It is designed to achieve JEDEC level 2.  It is used in SOT and SMX applications.


Applications Molding Compounds > Semiconductor Molding Compounds > Surface Mount / Lead Frames
Chemistry Epoxies
Media Carrier 100 % solid (incl. Hot Melt)
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol KL-G800H-CD 'Epoxy Mold Compound for Thin Leaded Packages'
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