HYSOL KL-G800H CD
HYSOL KL-G800H CD is a green epoxy molding compound suitable for thin leaded packages. It is designed to achieve JEDEC level 2. It is used in SOT and SMX applications.
Molding Compounds >
Semiconductor Molding Compounds >
Surface Mount / Lead Frames
|Media Carrier||100 % solid (incl. Hot Melt)|
|Cure Type||Heat cure|
|RoHS Compliant||Contact Henkel|