HYSOL MG40FS-AM
HYSOL MG40FS-AM epoxy molding compound delivers outstanding performance and ease of use. It is used in PDIP, SOIC and power discrete applications.
| Applications |
Molding Compounds >
Semiconductor Molding Compounds |
| Chemistry |
Epoxies |
| Media Carrier | 100 % solid (incl. Hot Melt) |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
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Loctite Hysol MG40FS-AM 'High Productivity Molding Compound'
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PDF
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Loctite Hysol MG40FS-AM 'High Productivity Molding Compound'
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PDF
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Product information
| IDH# | Item | Name | Size |
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| 1042463 | 1042463 | HYSOL MG40FS-AM |
15.0 carton
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