HYSOL TRA-BOND 2106
HYSOL TRA-BOND 2106 two component epoxy is designed for high strength structural bonding applications. It develops significant properties 1 hour after mixing. It can be heat or room temperature cured.
| Applications |
Adhesives >
Underfills >
Flip-Chip on Flex Capillary |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
| IDH# | Item | Name | Size |
|
| 1200220 | 1200220 | HYSOL TRA-BOND 2106 |
5.0 cc
|
|
| 1200221 | 1200221 | HYSOL TRA-BOND 2106 |
10.0 cc
|
