HYSOL UF3808
HYSOL UF3808 is a capillary underfill designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
| Applications |
Adhesives >
Underfills >
Reworkable CSP Underfill, Capillary Flow |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1440696 | 1440696 | HYSOL UF3808 |
50.0 ml
|
