HYSOL UF3808 is a capillary underfill designed to cure quickly at low temperatures to minimize stress to other components.  When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.

Applications Adhesives > Underfills > Reworkable CSP Underfill, Capillary Flow
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol UF3808 'Capillary underfil'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1440696 1440696 HYSOL UF3808
50.0 ml