HYSOL UF3810 reworkable epoxy underfill is designed for CSP and BGA applications. It  cures quickly at moderate temperatures to minimize stress to other components.  When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.

Applications Adhesives > Underfills > Reworkable CSP Underfill, Capillary Flow
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol UF3810 'Reworkable CSP Underfill'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1623008 1623008 HYSOL UF3810
50.0 ml  

Additional Documents

PR 200 'High Tg, Reworkable Underfill from Henkel'
UF3810 Sell Sheet