HYSOL UV3000LH
HYSOL UV3000LH UV cure adhesive is designed for high throughput assembly operations. A low halide version of UV3000. It is used in CMOS glass bonding.
| Applications |
Adhesives >
Photonics Adhesives >
Image Sensor & Camera Module Assembly, UV Cure |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | UV and light cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1599613 | 1599613 | HYSOL UV3000LH |
165.0 gm
|
