HYSOL UV3000LH UV cure adhesive is designed for high throughput assembly operations. A low halide version of UV3000.  It is used in CMOS glass bonding.

Applications Adhesives > Photonics Adhesives > Image Sensor & Camera Module Assembly, UV Cure
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type UV and light cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol UV3000LH 'Cationic-Curable Epoxy Adhesive'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1599613 1599613 HYSOL UV3000LH
165.0 gm