HYSOL XCE3120 anisotropic epoxy adhesive is designed for high throughput microelectronics assembly applications. It is ideal for use in combination with temperature sensitive substrates and components.

Applications Adhesives > Electrically Conductive Adhesives > Snap Cure
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol XCE3120 'Low Temperature, Snap Heat Cure, Anisotropic Conductive Adhesive Paste'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1189157 1189157 HYSOL XCE3120
10.0 g