(Known As LOCTITE 3323UV)

LOCTITE 3323  has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV fill encapsulants, such as 3327 and 3329. Either combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55 °C to +125 °C and humidity heat aging 85 °C / 85 % RH.

Applications Potting & Encapsulating > Dam Materials > Dam Materials - Chip-on-Board
Chemistry Epoxy based
Media Carrier 100 % liquid & paste
Cure Type UV and light cure
RoHS Compliant Contact Henkel

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
624315 624315 LOCTITE 3323
850.0 cc