(Known As LOCTITE 3327UV)

LOCTITE 3327 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV dam encapsulants, such as LOCTITE 3323. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55 °C to +125 °C and humidity heat aging 85 °C / 85 % RH.

Applications Potting & Encapsulating > Fill Materials > Fill Materials - Chip-on-Board
Chemistry Epoxy based
Media Carrier 100 % liquid & paste
Cure Type UV and light cure
RoHS Compliant Contact Henkel

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
624311 624311 LOCTITE 3327
1.0 l jar