LOCTITE 3327UV
LOCTITE 3327 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV dam encapsulants, such as LOCTITE 3323. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55 °C to +125 °C and humidity heat aging 85 °C / 85 % RH.
| Applications |
Potting & Encapsulating >
Fill Materials >
Fill Materials - Chip-on-Board |
| Chemistry |
Epoxy based |
| Media Carrier | 100 % liquid & paste |
| Cure Type | UV and light cure |
| RoHS Compliant | Contact Henkel |
| IDH# | Item | Name | Size |
|
| 624311 | 624311 | LOCTITE 3327 UV |
1.0 l
|
