Hysol 3329

Developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol® UV dam encapsulants, such as Hysol 3323. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55 °C to +125 °C and humidity heat aging 85 °C / 85 %

Applications Potting & Encapsulating > Fill Materials > Fill Materials - Chip-on-Board
Chemistry Epoxy based
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Loctite 3329 'UV Light Curing Epxoy Encapsulant -fill'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
3329_idh 3329 Hysol 3329