Hysol CB0260

Hysol CB0260 is a high adhesion version of FP4450 for temperatures up to 260°C after being exposed to L2 JEDEC preconditioning.

Applications Potting & Encapsulating > Fill Materials > Fill Materials - Chip-on-Board
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol CB0260 'Liquid Encapsulant'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
871833 871833 Hysol CB0260 (-40CD) 282g Iwashita 170ml