Hysol CB0260
Hysol CB0260 is a high adhesion version of FP4450 for temperatures up to 260°C after being exposed to L2 JEDEC preconditioning.
| Applications |
Potting & Encapsulating >
Fill Materials >
Fill Materials - Chip-on-Board |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 871833 | 871833 | Hysol CB0260 (-40CD) 282g Iwashita 170ml |
syringe
|
