Hysol CB0260-1

Hysol CB0260 is a high adhesion version of FP4450 for temperatures up to 260°C after being exposed to L2 JEDEC preconditioning.


Applications Potting & Encapsulating > Fill Materials > Fill Materials - Chip-on-Board
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol CB0260-1 'High performance encapsulan'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
708007 708007 Hysol CB0260-1 (-40CD) 282G Iwashita 170ML