Hysol CB064/FP4653
Hysol® CB064™ is high purity, low stress, liquid, self-leveling encapsulant material. This material is for cavity fill or dam and fill applications. The unique properties of CB064 allows for it to be “chocolate breakable" on pre-scored ceramic substrate.
| Applications |
Potting & Encapsulating >
Fill Materials Potting & Encapsulating > Low Stress Encapsulants |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | yes |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| cb046_fp4653 | 000000256413 | Hysol CB064/FP4653 |
|
|
| 1168959 | 1168959 | Hysol CB064 |
6.0 oz
syringe
|
