Hysol DC0114

DC0114 epoxy underfill is suitable for high reliability applications due to its combination of properties. It can be applied to ceramic or organic substrates, including solder masks and polyimide.


Applications Adhesives > Underfills > CSP Underfill, Flip Chip on Flex & Flip Chip-on-Board
Adhesives > Underfills > Flip-Chip on Flex Capillary
Chemistry Epoxy based
RoHS Compliant Contact Henkel

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1045678 dc0114 Hysol DC0114
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