Hysol DP1004

Hysol DP1004 is designed for bonding dissimilar substrates commonly used in ink jet applications and other MEMS devices.


Applications Adhesives > Die Attach Adhesives
Adhesives > Electrically Insulating Adhesives
Chemistry Epoxy based
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol DP1004 'Epoxy'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1464608 1464608 Hysol DP1004
55.0 cc syringe