Hysol DP1004
Hysol DP1004 is designed for bonding dissimilar substrates commonly used in ink jet applications and other MEMS devices.
| Applications |
Adhesives >
Die Attach Adhesives Adhesives > Electrically Insulating Adhesives |
| Chemistry |
Epoxy based |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1464608 | 1464608 | Hysol DP1004 |
55.0 cc
syringe
|
